High-Speed Digital Engineering Month
June 2010
(check course web pages for dates)
Please send me details of future digital engineering courses as I cannot make these dates.
Read the Electronics Weekly article about this event, which was published on 8 June 2007.
Six of the world's leading digital engineering specialists are coming to the University of Oxford
Led by Dr Howard Johnson, author of "High-Speed Digital Design - a Handbook of Black Magic", the University of Oxford's High-Speed Digital Engineering month offers a number of courses by six of the world's leading digital design experts.
"I can't think of any place else in the world an engineer could go to get direct access to this amount of high-speed digital engineering knowledge and experience. This event is unique in the world of electronics design" Dr Howard Johnson.
Courses:
- High-Speed Digital Design: A Workshop in Black Magic
Presenter - Dr Howard Johnson
2-day course
Learn about the important and timely issues involving high-speed digital design and signal integrity. This workshop will give participants the power to instantly recognise and solve many of today's high-speed design problems. - Advanced EMC: Fullwave Modelling for EMC and Signal Integrity
Presenter - Dr Bruce Archambeault
2-day course
This is an advanced-level EMC and Signal Integrity course for experienced board design and layout engineers. It is intended as an advanced sequel to the Printed Circuit Board Design for Real-World EMI Control course by Dr Bruce Archambeault. - Electronic Product Design and Retrofit for EMC
Presenter - Lee Hill
2-day course
Circuit design and EMC engineers will learn how to recognize and solve common electromagnetic compatibility (EMC) problems in PC boards, connectors, and cables. Understand and apply conductive, capacitive, inductive, and far-field coupling models to real hardware designs. - Printed Circuit Board Design for Real-World EMI Control
Presenter - Dr Bruce Archambeault
2-day course
The aim of this seminar is to help working board design and layout engineers understand the causes of EMC problems so this knowledge can be applied to real-world product design immediately. - EMC Lab Techniques for Designers (troubleshooting before you go to an EMC test site)
Presenter - Doug Smith
(1-day course)
This course covers techniques for finding design issues that may cause EMC compliance problems early in the design cycle, long before an official EMC test. - High Frequency Measurements (probes and equipment used in Signal Integrity and EMC work)
Presenter - Doug Smith
2-day course
This course covers techniques applicable to design and verification of high-speed digital and analogue circuits. The course is highly practical and contains many design tips and troubleshooting techniques. Electronic engineers from all fields will find the material and demonstrations useful. - High-Speed Noise and Grounding
Presenter - Dr Howard Johnson
2-day course
This is an advanced-level course for experienced digital designers who want to press their designs to the upper limits of speed and distance. It is an advanced sequel to the 2 courses High-Speed Digital Design and Advanced High-Speed Signal Propagation by Dr Howard Johnson. - Advanced Troubleshooting Techniques for Circuits and Systems
Presenter - Doug Smith
1-day course
The course covers advanced techniques for troubleshooting design problems both in the laboratory and in field installations. This seminar describes each technique in depth, how to apply it, and how to interpret results. Emphasis is placed on delivering practical knowledge that can be used immediately on the job. - Power Distribution Design
Presenter - Istvan Novak
2-day course
This course provides an overview of good power distribution design practices. Good and bad solutions are illustrated and put into context of layout constraints, cost and performance. - Suspect Counterfeit Detection, Avoidance and Mitigation
Presenter - Bob Vermillion
2-day course
This new addition to our High-Speed Digital Engineering Month provides a review of how semiconductor and medical device packaging countermeasures utilize advanced material solutions in an interactive case study format.